TECHNOLOGY
KEY FEATURES
- Ultra small
Our nanoscale sensor structures are up to ten times smaller.
Current MEMS structures have feature sizes of one micron or larger while our NEMS (Nano Electro Mechanical Systems) structures have features of 0.3 microns or less. This is a 100x area reduction.
- Save space
A typical MEMS sensor package needs two chips – one with the MEMS structure built on it and the second with the control electronics, resulting in a package of 4mm3. Our equivalent NEMS sensor package has everything on one chip and is only 1mm3 so we free up 3mm3 for every sensor that we replace with one of ours.
- Multi-sensor solutions
Additional NEMS sensor structures can be added to the same chip with hardly any increase in size. In the example shown of two motion sensor structures, they only take up about 10% of the chip. Additional sensor structures would be similar in size and most of the control electronics is shared, hence a multi-sensor solution is only slightly larger.
- No one else can make sensors so small as we do
A typical MEMS sensor package needs two chips – one with the MEMS structure built on it and the second with the control electronics, resulting in a package of 4mm3. Our equivalent NEMS sensor package has everything on one chip and is only 1mm3 so we free up 3mm3 for every sensor that we replace with one of ours.
- Patent Portfolio
CMOS was never designed for this and the released metal structures suffer from stress and distort. We have solved this with unique structure designs that we have created for the various sensor types that we do. We are protecting these designs with comprehensive patents to secure our position as the only company with NEMS-within-CMOS.
- Unlimited production volumes
Our disruptive technology will revolutionise this multi-billion-dollar sensor market by removing the barrier to high volume production as we can use any CMOS fab. We can enjoy the cost-saving benefits of CMOS shrinking to smaller nodes.
