Nanusens creates nanoscale sensor structures inside the CMOS layers


The sensors provide all sorts of data such as movement, rate of a heartbeat, acceleration during a fall, body temperature, number of steps taken, or room temperature for HVAC systems. Sensors are currently manufactured on a tiny sliver of silicon, or die, by a small number of specialist companies with each sensor type being produced on a dedicated production line so it is hard to ramp up production.

These are either packaged into the familiar black unit with wire connections to be mounted on a PCB or fixed beside the main chip as a bare die. Both approaches are relatively expensive and large with no current way to reduce costs and size forming a barrier to the advancement of the sensor market.


We have solved these two problems. Our breakthrough is being able to create the sensors directly within the control chip of the device, or ASIC, as the chip is being manufactured. This means that the sensors only take up a virtually insignificant amount of space by being in the chip itself instead of taking up space by being packaged beside it. Also, many different sensors can be built into a chip to make much smarter devices with a negligible increase in costs or space taken up inside the device.

Thus, Nanusens’ multi-sensor solution frees up space for more features and larger batteries to give a longer life in use. In addition, the power consumption is also dramatically reduced which helps extend the battery life even more.
Being able to include as many sensors as is required within a chip for almost no size or cost penalty is going to revolutionise the design of a whole new generation of smarter devices.


Nanusens is the only company to have perfected the building of MEMS within chips

Multiple sensors on one chip

Wide range of embeddable sensors