Dr Tom Hanley joins Nanusens as 
VP MEMS Engineering

Paignton, UK – 4 September 2024. Nanusens has announced the appointment of Dr Tom Hanley as its VP MEMS Engineering. He has over twelve years of experience in MEMS having worked for Sofant Technologies and Cirrus Logic in senior MEMS engineering roles and has a PhD from Newcastle University where he studied the development of novel resonant MEMS and SAW sensors.

Josep Montanyà, Nanusens’ CEO, commented, “We are delighted to have such an experienced MEMS specialist join the company. He will really help speed up the development of our MEMS technology using his depth of knowledge. I am particularly impressed by the multiple patents that he holds on MEMS that shows he is an innovative thinker and problem solver.”

Dr Tom Hanley, added, “I am really excited to be joining the Nanusens team. Its technology is truly innovative and is redefining the whole world of MEMS. Nanusens’ patented solutions comprise a wealth of elegant techniques to enable the use of the BEOL metal layers in a CMOS chip to build MEMS structures within the chip itself. This is by no means an easy task, but Nanusens has worked out how to design and manufacture completely novel structures that are robust and accurate. They form a key part of its patent portfolio which locks out anyone else trying to copy its MEMS-within-CMOS technology. Moreover, it is silicon proven and tested by third parties with a customer who has signed a license for the IP and customers who are negotiating to buy chips.”

About Nanusens

Nanusens, the MEMS innovator, was founded in 2014 by Dr. Josep Montanyà and Dr. Marc Llamas. Headquartered in Edinburgh, with a Research and Development office near Barcelona in Spain, Nanusens has been focused on finding a solution to address the limitations with traditional MEMS technology.
Rather than building a MEMS structure on top of a sliver of silicon using a specialized process in a specialized facility, Nanusens’ approach can create MEMS in the metal layers of a CMOS chip using standard processes at a normal CMOS fab. As a result, there are no production limitations and the costs are vastly reduced. As the new process takes place in the CMOS chip the structures are not microscopic in size, but nanoscopic. This cuts the power consumption of each sensor and means that several different types of sensors can be built at the same time within the chip, radically reducing the size of a multi-sensor solution. These MEMS advances will help to pave the way for the next generation of mobile phones, sensors and other smart devices.

For more information, please visit our website: www.nanusens.com
For media enquiries, please contact: Rachel Baker – rachel.baker@nanusens.com

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