Rupert Baines joins Nanusens board – Nanusens opens new Crowdcube funding round

Paignton, UK – 7 August 2024. One of the UK’s Semiconductor veterans, Rupert Baines, has now joined the Nanusens’ board. He has many years of C-level experience in a wide variety of electronics companies including CEO of UltraSoC (sold to Siemens) and CMO of Codasip and has been instrumental in several successful company sales. He is currently CEO of QPT Ltd that is developing power electronics for more efficient motors. In addition, he is chair of the UKTIN Semiconductor Expert Working Group and a Trustee of UKESF, a charity that encourages children to study electronics.

Josep Montanyà, Nanusens’ CEO, explained, “Rupert is another great addition to our board. His contacts span the worlds of semiconductors and investors which will be invaluable in helping us with the next exciting phase of our growth for which we have just opened a Crowdcube round at www.crowdcube.com/nanusens2024.”

Rupert Baines added, “The UK is a hot bed of innovation and I am always delighted to be able to help British companies fulfil their true potential. Nanusens has revolutionary technology for building nanoscale MEMS within CMOS layers for sensors and for RF Front End antenna tuners. To have a killer product where there is huge potential is amazing but to have one for two different markets is incredible.”

About Nanusens

Nanusens, the MEMS innovator, was founded in 2014 by Dr. Josep Montanyà and Dr. Marc Llamas. Headquartered in Edinburgh, with a Research and Development office near Barcelona in Spain, Nanusens has been focused on finding a solution to address the limitations with traditional MEMS technology.
Rather than building a MEMS structure on top of a sliver of silicon using a specialized process in a specialized facility, Nanusens’ approach can create MEMS in the metal layers of a CMOS chip using standard processes at a normal CMOS fab. As a result, there are no production limitations and the costs are vastly reduced. As the new process takes place in the CMOS chip the structures are not microscopic in size, but nanoscopic. This cuts the power consumption of each sensor and means that several different types of sensors can be built at the same time within the chip, radically reducing the size of a multi-sensor solution. These MEMS advances will help to pave the way for the next generation of mobile phones, sensors and other smart devices.

For more information, please visit our website: www.nanusens.com
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